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Booth: 5712

  • DOWA ELECTRONICS MATERIALS
    ExhibitorDOWA ELECTRONICS MATERIALS CO., LTD.
    DivisionNew Business Promotion Dept.
    Address14-1, Sotokanda 4-Chome, Chiyoda-ku, Tokyo
    TEL+81-3-6847-1250
    FAX+81-3-6847-7018
    E-maile101e108e101e99e116e114e111e110e105e99e115e64e100e111e119e97e46e99e111e46e106e112
    URLhttp://www.dowa.co.jp/
    DOWA Ag nano powder, Ag nano paste (enable to screen printing), Ag nano ink

    Ag nano powder

    (1) Ag nano powder-1 (Dia. approx. size: 20nm)

    (2) Ag nano powder-2 (Dia. approx. size: 60nm)

    (3) Ag nano powder-3 (Dia. approx. size: 100nm)

    Very good miscibility with general silver paste and solvents. Get the lowest resistivity to mix it.

    Ag nano paste

    (1)With resin type

    Good adhesion to PET and other films.

    (2) No resin type

    Good conductivity and thermal conductivity for high power LED and power device die bond. Alternative Pb free solders and conductive adhesive.

Concurrent event: Green Device 2010

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  • Displays/Panels
  • FPD Components/Materials
  • Mask/Reticle Manufacturing Devices
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  • Inspection, Measurement and Repair Devices
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