Technical Session

B32

Touch Panel Manufacturing and Materials

Shift Toward Larger, Cheaper Touch Panels Accelerating:Driving Touch Panel Adoption in New Applications

Datetime: 10/25  14:30 - 17:00

Floor: PACIFICO YOKOHAMA Conference Center

About lecture and lecturer

the latest developments of lamination technology for film sensor

Increase the demands on lamination with displays in tablet, note PC, SmartTV.And also structure of film sensor is changing from GFF to GF2 on these days.Based on plenty of experience with lamination machine and process, FUK explain the trend of lamination technology and development direction.

FUK Co.,Ltd

New materials for Touch Panel

As technology trends of the touch panel of the projected capacitive type, an integrated cover glass and built-in type are attention. In this lecture, we will introduce new materials including glass substitute material for realizing high-quality, thinner, light weight of the touch panel. It also includes the cost structure of related devices, and to clarify the issues that need to be improved.

Yasuhiro Ukai

Yasuhiro Ukai

Representative

Ukai Display Device Institute

Yasuhiro Ukai graduated from the department of the electrical engineering, Osaka University, in 1968, and joined Hosiden Electronics Co., Ltd. Since then, he has been engaged in the research and development on compound semiconductor thin-film devices and a-Si TFT-LCD. In 1999, he received his Ph.D. degree from the Tokyo Institute of Technology in Japan. In 1999, he joined Sony Corp. and worked at STLCD (a joint venture company of Sony and Toyota), where he contributed to establishing the mass-production technology in the area of low-temperature poly-Si (LTPS) TFT-LCDs. He was chief distinguished engineer and deputy general manager of Corporate R&D Display Device Development, working on the technology strategy and development of TFT-LCDs. He retired from Sony in 2008. He is a technical consultant as the UDDI (Ukai Display Device Institute) representative now. He received Japan Display ’86 Best Paper Award, Japan Display’89 Outstanding Paper Award, and SID’96 Best Application Paper Award. He is a member of the program committee of IDW’13 FMC-WS. He is a senior member of the Society for Information Display and member of the Institute of Electronics, Information, and Communication Engineers of Japan, and the Japan Applied Physics Society.

Volume Production Technology for OGS Using TEMPLOC® Stacking Technology

One-glass solution (OGS) touch panels are superior to in-cell and on-cell designs in terms of both production simplicity and cost, but have suffered from problems including degraded strength caused by edge processing for the toughened glass, and lower yields due to damage introduced in the fabrication process. The new TEMPLOC® temporary adhesive can be used to secure glass stacks during fabrication, resolving these problems with proven performance on about 20 million sheets. The speaker introduces new technologies developed over the last year, demonstrating the technical advantages of the TEMPLOC® method, specifically covering fabrication of chemically-strengthened glass, single-sheet stacking of large-size panels, and application of white markings on boards. Stacking methods are also introduced for tablets and other large-screen applications.

Tetsuya Tsushima

Executive Managing Director

Denka Adtecs Co., Ltd.

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